Learn how critical wafer bonding is in MEMS, sensors, microfluidic biochips, photonics devices, wafer level packaging and 3D heterogeneous integration.
Learn how Deep Reactive Ion Etching (Deep RIE or DRIE) elevates the etching of silicon wafers with high precision, enabling manufacturing of MEMS devices.
Discover the benefits of Silicon Optical Benches (SiOBs) and how they improve costs, precision, and size by moving optical integration to the wafer level.
Read how SiOBs empower optical integration and help deliver faster data rates per optical fiber in tranceivers that hit bandwidths of 800 GB per second.
Read how MEMS, micro versions of normal full-size mechanical and electrical components, allow smartphones, wearables, and automobiles to do amazing things.