Atomica’s extensive experience spans the full spectrum of MEMS, including photonics, sensors, microfluidic biochips, and other micro components. Our team of engineers and scientists utilizes a unique collaborative approach to development and manufacturing. Learn more below.
Photonics
Discover Atomica’s photonics technologies which empower optical communications, 3D sensing and LiDAR, augmented/virtual reality (AR/VR), thermal imaging, illumination, and other types of optical sensing.
Sensors
Atomica makes MEMS for thermal imaging, inertial measurement, microphones, gas and chemical detection, biological sensing, magnetics, pressure sensors and more.
Biochips
From drug-delivery devices to neural probes, cell sorters to biosensors, DNA synthesis to sequencing, learn how Atomica’s capabilities bring your biotechnologies to life.
Custom
Atomica has worked on hundreds of different MEMS projects. We have the capability and experience to support the custom design and production of virtually any type of MEMS device.
Contact us to see how we can help bring your MEMS project to life.
Featured E-book
Learn how SiOBs enable micro level optical integration, thus improving cost, precision and reducing size.
Featured E-book
Discover more about WLP, one of the great enablers of 3-D integration
Featured E-book
Learn about the power of 3D lithography (greyscale) to create complex works, like the Mona Lisa, at the wafer level.
Featured E-book
Managing the six key design decisions in the creation of MEMS Mirrors
Capabilities
Atomica offers the most complete wafer fabrication services, featuring the largest pure-play MEMS production fab in the United States and most extensive suite of tools of any independent manufacturer to meet our customers’ high-volume production requirement and MEMS foundry services.
Design
Read about Atomica’s MEMS design and modeling services that complement our wafer foundry capabilities.
Lithography
Learn about Atomica’s photolithography technologies and leading-edge greyscale (3D) lithography.
Deposition
Discover Atomica’s deposition tools and its wide range of metals and dielectric deposition capabilities.
Etching
Atomica offers both dry etching (RIE, DRIE, ion milling) and wet etching capabilities.
TSVs
Discover Atomica’s Through-Silicon Vias (TSVs) which allow electrical signals to pass through substrates.
Latest insights
- What is Wafer Bonding? - Learn how critical wafer bonding is in the creation of MEMS, sensors,… Read More
- What is Deep Reactive Ion Etching (DRIE or Deep RIE) ? - Learn how Deep Reactive Ion Etching (DRIE) enables etching of silicon wafers… Read More
- SiOBs: What are Silicon Optical Benches? - Discover the benefits of Silicon Optical Benches (SiOBs), which are named after… Read More
Connect with the deepest bench in the MEMS industry
Atomica has more than 20 PhDs and 20+ years solving the toughest problems in the MEMS industry.