Wafer Bonding

Atomica’s bonding allows hermetic and vacuum wafer-level packaging to reduce the cost of post-process die-level packaging and to improve the performance and reliability of the MEMS

Wafer Bonding is a critical capability required for wafer-level hermetic packaging or creating 3-D microfluidics devices. Over 50% of all wafers produced at Atomica are wafer bonded.

The most critical aspect of making a WLP is the bonding process chosen to align and attach the various wafers in the stack (e.g., connecting a base wafer, interposer, device wafer, and/or a lid wafer).

Bonding Technologies

Atomica works closely with the customers’ needs to determine the appropriate bonding method. Frequently, multiple bonding methods can be combined to achieve the desired final packaging. In addition to hermeticity requirements, other considerations include:

  • Design/device footprint
  • Temperature budget
  • Materials used
  • Final packaging and environmental requirements

Bonding Methods and Details:

Low temperature metal alloy bond
  • <190C
  • Hermetic
  • Narrow bond line
Glass frit bond
  • >400C
  • Compatible with getter firing temperatures
  • Hermetic
Anodic bond
  • ~300C or higher
  • ~300V bias
  • Hermetic
Si Fusion
  • Very strong
  • Hermetic
  • 1000C annealing process
Au-Au thermo-compression bond
  • 200 – 350C
  • Hermetic
  • Less tolerant to wafer topography
Polymer bond
  • Low temp, low cost
  • Non-hermetic

Why Atomica?

  1. Largest US MEMS Foundry

    Atomica serves its customers from a 13-acre, 130,000 ft2 manufacturing campus (including a 30,000 ft2 class 100 cleanroom) in Santa Barbara, California. We operate over 400 sophisticated 150mm and 200mm tools and are ISO 9001 and ITAR certified. This makes us the largest independent MEMS fab in the United States, well-positioned to support the growing demand for domestic production of critical sensors, photonics, and biochips.

  2. Unique collaborative methodology to ensure program success

    At Atomica, we are resolved to help our customers bring their innovations to life using our proven phase-gate process to successfully navigate the challenges of design, development, prototype, scale-up, and high-volume production. Our multi-disciplinary team of scientists and manufacturing engineers tackles the hardest process development and integration challenges with an eye toward manufacturability (DFM). Our methodology entails rigorous project management to optimize resources, mitigate risks, and deliver predictable results.

  3. Extraordinary engineering expertise

    Atomica has over 20 years of experience commercializing technologies that change the future. Our extensive experience spans the full spectrum of MEMS, including photonics, sensors, microfluidic biochips, and other micro components. We have over 20 Phds on-site and we’ve worked on hundreds of programs to date. You could say we’ve seen it all. This experience combined with our volume production facility help ensure customers get to market fast with the highest chance of commercial success.

  4. Exceptional flexibility in materials and project types

    Atomica has a versatile and flexible engagement model. We are able to engage using our standard processes or provide bespoke, custom process development. We will consider programs of many sizes, as long as they hold promise to have an impact on the world once they reach production. Atomica also is able to handle a very broad range of materials providing access to an extensive set of processes and materials unavailable in CMOS fabs, including noble metals, polymers, and virtually any substrate (e.g., silicon, SOI, glass, fused silica, quartz, borosilicate, piezos, and III-V).