Microfabrication for photonic systems

Atomica’s Microlens Platform provides a foundation for individual lenses and arrays that focus, collect and shape light. Lens curvature, diameter and material determine focal length and optical behavior. Fabrication considers surface smoothness, refractive-index uniformity and alignment across an array. Lens geometry and coating choices are developed around the operating wavelength, with integration features that position each lens relative to adjacent components.

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The Micromirror Platform supports movable reflective surfaces that tilt or rotate to control the direction of light. Mirrors are suspended on torsion springs or flexible hinges, with actuation chosen for the required motion and control. Development addresses surface flatness, reflective coatings, electrode gaps and suspension geometry. Mirror size, deflection range and packaging are considered together to preserve optical quality and protect the moving elements.

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Atomica’s Waveguide Platform supports optical routing on photonic chips and planar waveguides for augmented reality displays. Chip-based waveguides confine and route light between components, while display waveguides guide image light across a transparent substrate and direct it toward the eye. Materials, optical geometry and coupling features are matched to the operating wavelength and application. Fabrication controls dimensions, surface quality and pattern alignment to support efficient transmission, with packaging and thermal behavior evaluated to maintain optical performance.

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The V-Groove Platform provides alignment channels that locate optical fibers relative to one another and to nearby photonic components. In silicon, anisotropic etching uses the crystal orientation to define the groove profile. Groove width, depth and pitch determine fiber placement, while surface quality and array uniformity support consistent seating. These passive alignment features can be combined with optical benches and bonding steps in a complete device flow.

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Atomica’s Silicon Optical Bench Platform provides a silicon foundation for aligning and integrating lasers, lenses, detectors and other optical components. Etched mounting features, cavities and alignment marks establish component positions. Waveguides and electrical routing can be incorporated to connect elements across the bench. Development considers coupling accuracy, mechanical stability and heat dissipation, bringing optical and electronic interfaces together.

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The Interposer Platform provides an intermediate substrate that connects photonic devices, electronics and package interfaces. Redistribution layers route signals across the surface, while through-wafer vias provide vertical connections where required. Substrate selection, routing pitch and layer alignment are developed around the electrical and mechanical requirements. Power distribution, signal integrity and thermal expansion are considered across the package.

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Atomica’s Wafer Level Package Platform uses silicon, glass, quartz and metals to protect delicate structures before wafer singulation. Packages routinely achieve over 99% hermeticity, with sub-mTorr vacuum packaging for high-vacuum applications. Production experience includes four- and five-wafer stacks, with bonding and thermal stress evaluated to maintain performance. Through-silicon vias (TSVs), through-glass vias (TGVs) and optical access features support integration while preserving the protected environment.

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The Through Silicon Via Platform creates electrical paths through a silicon wafer or die. Etched vias receive insulating and barrier layers before conductive material is deposited, linking circuitry on opposite surfaces or between stacked components. Via diameter, depth and spacing influence resistance, capacitance and fabrication complexity. Development coordinates etching, metallization and wafer thinning while addressing thermal stress and interconnect reliability.

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Atomica’s Through Glass Via Platform creates conductive paths through glass for vertical signal and power routing. Holes formed in the substrate are coated or filled with metal, connecting features on opposite surfaces. Glass provides electrical isolation and can preserve optical access around the vias. Development considers glass composition, via geometry, metal coverage and adhesion, with thermal expansion and mechanical stress evaluated for the integrated device.

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