Atomica’s extensive experience spans the full spectrum of MEMS, including photonics, sensors, microfluidic biochips, and other micro components. Our team of engineers and scientists utilizes a unique collaborative approach to development and manufacturing. Learn more below.

Photonics

Discover Atomica’s photonics technologies which empower optical communications, 3D sensing and LiDAR, augmented/virtual reality (AR/VR), thermal imaging, illumination, and other types of optical sensing.

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Sensors

Atomica makes MEMS for thermal imaging, inertial measurement, microphones, gas and chemical detection, biological sensing, magnetics, pressure sensors and more.

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Biochips

From drug-delivery devices to neural probes, cell sorters to biosensors, DNA synthesis to sequencing, learn how Atomica’s capabilities bring your biotechnologies to life.

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Custom

Atomica has worked on hundreds of different MEMS projects. We have the capability and experience to support the custom design and production of virtually any type of MEMS device.

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Contact us to see how we can help bring your MEMS project to life.

Capabilities

Atomica (formerly IMT) offers the most complete wafer fabrication services, featuring the largest pure-play MEMS production fab in the United States and most extensive suite of tools of any independent manufacturer to meet our customers’ high-volume production requirement and MEMS foundry services.

Design

Read about Atomica’s MEMS design and modeling services that complement our wafer foundry capabilities.

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Lithography

Learn about Atomica’s photolithography technologies and leading-edge greyscale (3D) lithography.

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Deposition

Discover Atomica’s deposition tools and its wide range of metals and dielectric deposition capabilities.

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Etching

Atomica offers both dry etching (RIE, DRIE, ion milling) and wet etching capabilities.

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Bonding

Learn how Atomica’s bonding allows hermetic and vacuum wafer-level packaging.

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WLP

Read how Atomica’s Wafer Level Packaging routinely achieves over 99% hermeticity.

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TSVs

Discover Atomica’s Through-Silicon Vias (TSVs) which allow electrical signals to pass through substrates.

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Backend

Read about Atomica’s backend capabilities from wafer thinning to dicing.

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Testing

Read about Atomica’s comprehensive testing and metrology capabilities.

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Latest insights

Connect with the deepest bench in the MEMS industry

Atomica (formerly IMT) has more than 20 PhDs and 20+ years solving the toughest problems in the MEMS industry.

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