Learn about Atomica’s groundbreaking Through Silicon Via (TSV) technology and how it revolutionizes semiconductor integration.
Learn about the differences between a CMOS and MEMS fab and what the leading US MEMS fab, Atomica, has to offer.
Learn how critical wafer bonding is in MEMS, sensors, microfluidic biochips, photonics devices, wafer level packaging and 3D heterogeneous integration.
Learn how Deep Reactive Ion Etching (Deep RIE or DRIE) elevates the etching of silicon wafers with high precision, enabling manufacturing of MEMS devices.
Discover the benefits of Silicon Optical Benches (SiOBs) and how they improve costs, precision, and size by moving optical integration to the wafer level.