Atomica’s AI Thermal Microstructures Platform enables local cooling, heat spreading, fluid control & advanced package integration.
The platform helps customers build microfabricated structures for compact laser sources, fiber coupling, thermal stability, and AI optical interconnect.
Learn about Atomica’s groundbreaking Through Silicon Via (TSV) technology and how it revolutionizes semiconductor integration.
Learn about the differences between a CMOS and MEMS fab and what the leading US MEMS fab, Atomica, has to offer.
Learn how Deep Reactive Ion Etching (Deep RIE or DRIE) elevates the etching of silicon wafers with high precision, enabling manufacturing of MEMS devices.