Learn how critical wafer bonding is in the creation of MEMS, sensors, biochips, photonics devices and 3D heterogeneous integration.
Learn how Deep Reactive Ion Etching (DRIE) enables etching of silicon wafers with high precision, enabling manufacturing of MEMS, biochips and photonics devices.
Read how Atomica has advanced to the forefront of the MEMS industry, supporting the domestic production of critical sensors, photonics, and biochips.
Read how the Rapier extends development and production capability for our growing customer base in photonics, BioMEMS and sensors.
Atomica announces that Eric Sigler has been promoted to Chief Executive Officer. Additionally, Johan Denecke, who previously led manufacturing and quality at Illumina and Thermo Fisher, has joined Atomica as its new Senior Vice President of Operations.