Wafer Level Packaging (WLP)

More than 80% of programs at Atomica implement wafer level packaging (WLP) with some projects requiring as many 6 wafers for integration and miniaturization.

Packaging (also called semiconductor device assembly, assembly, encapsulation or sealing) is the final manufacturing stage of semiconductor device fabrication, in which integrated circuits (IC), processors, sensors, imaging devices, optoelectronics, micro-electromechanical systems (MEMS) and other components are mounted or encapsulated in a supporting case that prevents physical or environmental damage.

The case, known as a “package”, supports the electrical contacts which connect the device to a circuit board or larger system for its subsequent operation; this routing is often achieved with a redistribution layer (RDL) within an interposer. The process of bringing the fabricated device into a mountable case is referred to as packaging.


  • Atomica implements materials such as silicon, glass, quartz, metals, and others to realize these devices, often mixing and matching other technology modules, such as ATOMICA’s through silicon vias (TSVs), to simplify routing and to signals to the outside world.
  • Atomica routinely achieves over 99% hermeticity with its wafer level packages, including sub-mTorr vacuum WLP for applications that require high vacuum packaging.
  • Atomica utilizes wafer-level packaging technology in several production programs that requires 4 and 5 wafers stacked together.
  • Atomica differentiates itself by blazing the trail in complex integration of process and technologies though wafer-level packaging.

Why Atomica?

  1. Largest US MEMS Foundry

    Atomica serves its customers from a 13-acre, 130,000 ft2 manufacturing campus (including a 30,000 ft2 class 100 cleanroom) in Santa Barbara, California. We operate over 400 sophisticated 150mm and 200mm tools and are ISO 9001 and ITAR certified. This makes us the largest independent MEMS fab in the United States, well-positioned to support the growing demand for domestic production of critical sensors, photonics, and biochips.

  2. Unique collaborative methodology to ensure program success

    At Atomica, we are resolved to help our customers bring their innovations to life using our proven phase-gate process to successfully navigate the challenges of design, development, prototype, scale-up, and high-volume production. Our multi-disciplinary team of scientists and manufacturing engineers tackles the hardest process development and integration challenges with an eye toward manufacturability (DFM). Our methodology entails rigorous project management to optimize resources, mitigate risks, and deliver predictable results.

  3. Extraordinary engineering expertise

    Atomica has over 20 years of experience commercializing technologies that change the future. Our extensive experience spans the full spectrum of MEMS, including photonics, sensors, microfluidic biochips, and other micro components. We have over 20 Phds on-site and we’ve worked on hundreds of programs to date. You could say we’ve seen it all. This experience combined with our volume production facility help ensure customers get to market fast with the highest chance of commercial success.

  4. Exceptional flexibility in materials and project types

    Atomica has a versatile and flexible engagement model. We are able to engage using our standard processes or provide bespoke, custom process development. We will consider programs of many sizes, as long as they hold promise to have an impact on the world once they reach production. Atomica also is able to handle a very broad range of materials providing access to an extensive set of processes and materials unavailable in CMOS fabs, including noble metals, polymers, and virtually any substrate (e.g., silicon, SOI, glass, fused silica, quartz, borosilicate, piezos, and III-V).