Wafer Processing Backend

Atomica’s backend processing involves both wafer thinning and dicing to customer demands.

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Atomica offers die singulation services on both 6” and 8” wafer format. By utilizing a mechanical saw technique, partial slicing to expose bond pads can be incorporated when necessary, a process often refer to as Pad Reveal. Exposure to the bond pads prior to singulation allows for wafer-level testing. Dies are then either shipped on UV curable tape or in individual packages.

Wafer Thinning

Wafer thinning capability is a key tool for reducing the overall profile of a device or to expose materials that are embedded in the wafer. Atomica provides the thickness control as well as both roughness and smoothness of the finished surfaces that our customers desire.

The ability to thin wafers is critical to applications that require meeting certain form factors for packaging at the back end of the line assembly, fitting specific thickness profiles. For building more complex layers, the ability to polish heterogeneous material sets simplifies wafer processing by planarizing the surface instead of accommodating topography.

Details: Wafer grinding abilities are to +/- 5 µm tool tolerance.

Chemical Mechanical Polishing

Chemical Mechanical Polishing complements wafer thinning capability, which involves planarization and polishing to return the substrate surface to continue down the front end processing.

  • CMP: Post-CMP surface roughness in the nm-range
  • Polished surface can be processed or bonded

Wafer Dicing

Atomica offers die singulation services on both 6” and 8” wafer format. By utilizing a mechanical saw technique, partial slicing to expose bond pads can be incorporated when necessary, a process often refer to as Pad Reveal. Exposure to the bond pads prior to singulation allows for wafer-level testing. Dies are then either shipped on UV curable tape or in individual packages.

Other Capabilities

Photolithography

Learn about Atomica’s photolithography technologies and leading-edge greyscale (3D) lithography.

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Deposition

Discover Atomica’s deposition tools and its wide range of metals and dielectric deposition capabilities.

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Etching

Atomica offers both dry etching (RIE, DRIE, ion milling) and wet etching capabilities.

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Why Atomica?

Atomica Corp. unleashes the power of Micro Electro-Mechanical Systems (MEMS) to help solve the great problems of our time. Utilizing a uniquely collaborative approach to development and manufacturing, it partners with innovative companies to deliver breakthrough MEMS-based solutions in cloud computing, autonomous vehicles, cell therapy, molecular diagnostics, genomics, 5G, the Internet of Things (IoT), and more. Atomica is the largest MEMS foundry in the USA, serving customers from its 130,000 ft2 manufacturing campus (including a 30,000 ft2 class 100 cleanroom) in Santa Barbara, California. The company is ISO 9001 certified and ITAR registered. Its extensive experience spans the full spectrum of MEMS, including photonics, sensors, microfluidic biochips, and other micro components.

Next Steps

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Master Deep RIE: Atomica’s Expertise, Techniques and Tool Set in DRIE.

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