Deposition
Atomica’s wide variety of deposition tools and experience opens up our unparalleled material toolbox. This material flexibility gives us the power to accommodate and address electrical, mechanical and thermal constraints.
Atomica’s Vacuum Deposition and Electroplating
Atomica has a whole host of different targets under vacuum in multiple production-class cluster tools, from RF and DC magnetron systems to evaporators, LPCVD, and PECVD, as well as thermal oxidation and annealing furnaces.
Electroplating capability enables creating tall structural and functional features, such as molds, conductive coils, magnets, actuators, etc.
Tools
- Applied Materials Endura PVD
- Plasma Therm High Density – PECVD
- Veeco ALD Phoenix
- Veeco ion beam metal and dielectric deposition – Including reactive sputtering
- CVC PVD cluster tool – metal and dielectric deposition
- SFI Endeavor – sputtered metal film deposition
- CHA Electron Beam Evaporator
- Tystar LPCVD
- SPTS PECVD
- MRL Thermal oxidation and annealing furnaces
Specs
Vacuum Deposition for Precision Thin Film Metals and Alloys:
- Atomica can deposit: Au, Ag, Pt, Al, Cr, Ti, TiW, W, Mo, NiFe, Cu, Ta, NiMn and many others
- 8 Angstroms to 1.5 µm for metals
Vacuum Deposition for Thin and Thick Film Dielectrics:
- Atomica can deposit: SiO2, Si3N4, Al2O3, TaO, TaN and many others
- Up to 60 µm deposition capability for dielectrics
Wet Plating (Electro/Electroless) of thick metal and alloys:
- Atomica can plate: NiFe, Ni, NiCo, Au, Cu, solder, and others
- Thickness: from 1 µm up to 50 µm
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Featured Deposition Tool
APPLIED MATERIALS ENDURA PVD
The Applied Endura platform is the most successful metallization system in the history of the semiconductor industry. Its deposition capabilities span front-end metallization, e.g., cobalt and tungsten; aluminum and copper interconnect; and packaging applications, e.g., under bump metallization.
- Capacity to deposit a wide variety of ultra-pure films with tight control over film thickness, superior bottom coverage, and high conformality
- Five PVD chambers, plus two preclean chambers for native oxide removal
- Handling transparent wafers reliably from load lock wafer mapping to clear wafer orientation to wafer placement
- 150mm and 200mm operation
Featured Deposition Tool
PLASMA-THERM’S VERSALINE HDPCVD
Plasma-Therm’s VERSALINE HDPCVD product uses a new approach to achieving highly dense and conformal films at low substrate temperatures. The system utilizes a high-density ICP plasma with a temperature-controlled and biased substrate. Uniform gas injection at the substrate level maximizes film quality.
- Substrate temperature control via mechanical clamp
- Substrate bias at 13.56 MHz
- Low particulate processing environment with thermally managed reactor design — up to 180°C for walls and showerhead
- Process benefits include: Low temperature, Trench Fill, High-density films, High uniformity, Tunable index and Doping
Featured Deposition Tool
VEECO PHOENIX ATOMIC-LAYER DEPOSITION (ALD) SYSTEM
The Veeco Phoenix Atomic-Layer Deposition (ALD) system enables high-quality atomic-scale conformal coatings.
- Designed to deposit pinhole free coatings that are perfectly uniform in thickness, even deep inside pores, trenches and cavities.
- The ability to deposit such high-quality films on substrates with ultra-high aspect ratios
- A wide variety of thin films can be deposited
- used to manufacture encapsulating hermetic coatings
- uses no plasmas making it ideal for a variety of delicate substrates
- coatings via ALD include: Silicon Oxide, Aluminum Oxide, Titanium Nitride, Lithium Fluoride
Why Atomica?
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Largest US MEMS Foundry
Atomica serves its customers from a 13-acre, 130,000 ft2 manufacturing campus (including a 30,000 ft2 class 100 cleanroom) in Santa Barbara, California. We operate over 400 sophisticated 150mm and 200mm tools and are ISO 9001 and ITAR certified. This makes us the largest independent MEMS fab in the United States, well-positioned to support the growing demand for domestic production of critical sensors, photonics, and biochips.
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Unique collaborative methodology to ensure program success
At Atomica, we are resolved to help our customers bring their innovations to life using our proven phase-gate process to successfully navigate the challenges of design, development, prototype, scale-up, and high-volume production. Our multi-disciplinary team of scientists and manufacturing engineers tackles the hardest process development and integration challenges with an eye toward manufacturability (DFM). Our methodology entails rigorous project management to optimize resources, mitigate risks, and deliver predictable results.
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Extraordinary engineering expertise
Atomica has over 20 years of experience commercializing technologies that change the future. Our extensive experience spans the full spectrum of MEMS, including photonics, sensors, microfluidic biochips, and other micro components. We have over 20 Phds on-site and we’ve worked on hundreds of programs to date. You could say we’ve seen it all. This experience combined with our volume production facility help ensure customers get to market fast with the highest chance of commercial success.
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Exceptional flexibility in materials and project types
Atomica has a versatile and flexible engagement model. We are able to engage using our standard processes or provide bespoke, custom process development. We will consider programs of many sizes, as long as they hold promise to have an impact on the world once they reach production. Atomica also is able to handle a very broad range of materials providing access to an extensive set of processes and materials unavailable in CMOS fabs, including noble metals, polymers, and virtually any substrate (e.g., silicon, SOI, glass, fused silica, quartz, borosilicate, piezos, and III-V).