Atomica’s wide variety of deposition tools and experience opens up our unparalleled material toolbox. This material flexibility gives us the power to accommodate and address electrical, mechanical and thermal constraints.

The ability to handle a variety of materials allows flexibility in making MEMS. Depending on functional, structural, and electrical requirements, as well as temperature budget and any backend assembly constraints, Atomica offers a wide range of metals and dielectric deposition capabilities.

Atomica can deposit a variety of materials, whether thin or thick film. And offers both vacuum deposition and wet chemistry solution of electro and electroless plating, all depending on your application.

Atomica’s Vacuum Deposition and Electroplating

Atomica has a whole host of different targets under vacuum in multiple production-class cluster tools, from RF and DC magnetron systems to evaporators, LPCVD, and PECVD, as well as thermal oxidation and annealing furnaces.

Electroplating capability enables creating tall structural and functional features, such as molds, conductive coils, magnets, actuators, etc.


  • Applied Materials Endura PVD
  • Plasma Therm High Density – PECVD
  • Veeco ALD Phoenix
  • Veeco ion beam metal and dielectric deposition – Including reactive sputtering
  • CVC PVD cluster tool – metal and dielectric deposition
  • SFI Endeavor – sputtered metal film deposition
  • CHA Electron Beam Evaporator
  • Tystar LPCVD
  • MRL Thermal oxidation and annealing furnaces


Vacuum Deposition for Precision Thin Film Metals and Alloys:
  • Atomica can deposit: Au, Ag, Pt, Al, Cr, Ti, TiW, W, Mo, NiFe, Cu, Ta, NiMn and many others
  • 8 Angstroms to 1.5 µm for metals
Vacuum Deposition for Thin and Thick Film Dielectrics:
  • Atomica can deposit: SiO2, Si3N4, Al2O3, TaO, TaN and many others
  • Up to 60 µm deposition capability for dielectrics
Wet Plating (Electro/Electroless) of thick metal and alloys:
  • Atomica can plate: NiFe, Ni, NiCo, Au, Cu, solder, and others
  • Thickness: from 1 µm up to 50 µm

Why Atomica?

  1. Largest US MEMS Foundry

    Atomica serves its customers from a 13-acre, 130,000 ft2 manufacturing campus (including a 30,000 ft2 class 100 cleanroom) in Santa Barbara, California. We operate over 400 sophisticated 150mm and 200mm tools and are ISO 9001 and ITAR certified. This makes us the largest independent MEMS fab in the United States, well-positioned to support the growing demand for domestic production of critical sensors, photonics, and biochips.

  2. Unique collaborative methodology to ensure program success

    At Atomica, we are resolved to help our customers bring their innovations to life using our proven phase-gate process to successfully navigate the challenges of design, development, prototype, scale-up, and high-volume production. Our multi-disciplinary team of scientists and manufacturing engineers tackles the hardest process development and integration challenges with an eye toward manufacturability (DFM). Our methodology entails rigorous project management to optimize resources, mitigate risks, and deliver predictable results.

  3. Extraordinary engineering expertise

    Atomica has over 20 years of experience commercializing technologies that change the future. Our extensive experience spans the full spectrum of MEMS, including photonics, sensors, microfluidic biochips, and other micro components. We have over 20 Phds on-site and we’ve worked on hundreds of programs to date. You could say we’ve seen it all. This experience combined with our volume production facility help ensure customers get to market fast with the highest chance of commercial success.

  4. Exceptional flexibility in materials and project types

    Atomica has a versatile and flexible engagement model. We are able to engage using our standard processes or provide bespoke, custom process development. We will consider programs of many sizes, as long as they hold promise to have an impact on the world once they reach production. Atomica also is able to handle a very broad range of materials providing access to an extensive set of processes and materials unavailable in CMOS fabs, including noble metals, polymers, and virtually any substrate (e.g., silicon, SOI, glass, fused silica, quartz, borosilicate, piezos, and III-V).