Through Silicon Vias (TSV) and Interposers

Atomica (formerly IMT) has been working with TSVs for years and is producing products today with nearly 140,000 hermetic metal-filled TSVs per wafer.

Through silicon vias (TSVs) represent critical technology for the future in that they are a key enabler to reach large-scale 3D integration. Because they allow electrical signals to pass through the substrates, they enable smaller device sizes and a reduced signal path. Atomica’s customers use TSVs to reduce routing complexity, and increase integration while maintaining or in some cases, shrinking the footprint.

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TSV Details

Copper TSVs can dramatically improve electrical performance – specifically required in the RF world. Based on your product specific design requirements, Atomica’s TSV platform offers fundamental basis for optimizing your customized solution.

Atomica’s copper TSV technology offers:

  • DC resistance of less than 0.01 ohms per via
  • Insertion loss of -0.01 dB at 6 GHz
  • 15 µm diameter x 50 µm depth
  • 50 µm diameter x 250 µm depth

MEMS Si Interposers Details:

  • MEMS Si interposers is the next step in multi-layer PCB for 3D integration and wafer-level packaging, enabling electrical connectivity on extremely small footprint.
  • The interposers may contain complex electrical paths and circuits that re-route and/or re-characterize signals from the micro-device and in turn, interface with additional components or perhaps an entire system.
  • Lines and spaces are reduced by a factor of 10 from traditional PCB

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Why Atomica?

  1. Largest US MEMS Foundry

    Atomica serves its customers from a 13-acre, 130,000 ft2 manufacturing campus (including a 30,000 ft2 class 100 cleanroom) in Santa Barbara, California. We operate over 400 sophisticated 150mm and 200mm tools and are ISO 9001 and ITAR certified. This makes us the largest independent MEMS fab in the United States, well-positioned to support the growing demand for domestic production of critical sensors, photonics, and biochips.

  2. Unique collaborative methodology to ensure program success

    At Atomica, we are resolved to help our customers bring their innovations to life using our proven phase-gate process to successfully navigate the challenges of design, development, prototype, scale-up, and high-volume production. Our multi-disciplinary team of scientists and manufacturing engineers tackles the hardest process development and integration challenges with an eye toward manufacturability (DFM). Our methodology entails rigorous project management to optimize resources, mitigate risks, and deliver predictable results.

  3. Extraordinary engineering expertise

    Atomica has over 20 years of experience commercializing technologies that change the future. Our extensive experience spans the full spectrum of MEMS, including photonics, sensors, microfluidic biochips, and other micro components. We have over 20 Phds on-site and we’ve worked on hundreds of programs to date. You could say we’ve seen it all. This experience combined with our volume production facility help ensure customers get to market fast with the highest chance of commercial success.

  4. Exceptional flexibility in materials and project types

    Atomica has a versatile and flexible engagement model. We are able to engage using our standard processes or provide bespoke, custom process development. We will consider programs of many sizes, as long as they hold promise to have an impact on the world once they reach production. Atomica also is able to handle a very broad range of materials providing access to an extensive set of processes and materials unavailable in CMOS fabs, including noble metals, polymers, and virtually any substrate (e.g., silicon, SOI, glass, fused silica, quartz, borosilicate, piezos, and III-V).

Connect with the deepest bench in the MEMS industry

IMT has more than 20 PhDs and 20+ years of solving the toughest problems in the MEMS industry.

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