Wafer Processing Backend
Atomica’s backend processing involves both wafer thinning and dicing to customer demands.
Featured Backend Tool
STRASBAUGH 7AF WAFER GRINDER
The Strasbaugh 7AF is a fully automated, cassette loaded wafer grinding solution. The force sensitive mechanics and advanced control system allows adaptive grinding that is determined by grinding wheel dynamics.
- Provides superior finish and thickness control
- Reduces subsurface damage
- Increases product yield
- Provides adaptive grinding
- Has coarse and fine grinding stations