Atomica’s extensive experience spans the full spectrum of MEMS, including photonics, sensors, microfluidic biochips, and other micro components. Our team of engineers and scientists utilizes a unique collaborative approach to development and manufacturing. Learn more below.


Discover Atomica’s photonics technologies which empower optical communications, 3D sensing and LiDAR, augmented/virtual reality (AR/VR), thermal imaging, illumination, and other types of optical sensing.

Learn More


Atomica makes MEMS for thermal imaging, inertial measurement, microphones, gas and chemical detection, biological sensing, magnetics, pressure sensors and more.

Learn More


From drug-delivery devices to neural probes, cell sorters to biosensors, DNA synthesis to sequencing, learn how Atomica’s capabilities bring your biotechnologies to life.

Learn More


Atomica has worked on hundreds of different MEMS projects. We have the capability and experience to support the custom design and production of virtually any type of MEMS device.

Learn More

Contact us to see how we can help bring your MEMS project to life.


Atomica offers the most complete wafer fabrication services, featuring the largest pure-play MEMS production fab in the United States and most extensive suite of tools of any independent manufacturer to meet our customers’ high-volume production requirement and MEMS foundry services.


Read about Atomica’s MEMS design and modeling services that complement our wafer foundry capabilities.

Learn More


Learn about Atomica’s photolithography technologies and leading-edge greyscale (3D) lithography.

Learn More


Discover Atomica’s deposition tools and its wide range of metals and dielectric deposition capabilities.

Learn More


Atomica offers both dry etching (RIE, DRIE, ion milling) and wet etching capabilities.

Learn More


Learn how Atomica’s bonding allows hermetic and vacuum wafer-level packaging.

Learn More


Read how Atomica’s Wafer Level Packaging routinely achieves over 99% hermeticity.

Learn More


Discover Atomica’s Through-Silicon Vias (TSVs) which allow electrical signals to pass through substrates.

Learn More


Read about Atomica’s backend capabilities from wafer thinning to dicing.

Learn More


Read about Atomica’s comprehensive testing and metrology capabilities.

Learn More

Latest insights