Learn about Atomica’s groundbreaking Through Silicon Via (TSV) technology and how it revolutionizes semiconductor integration.
Learn about the differences between a CMOS and MEMS fab and what the leading US MEMS fab, Atomica, has to offer.
Learn how Deep Reactive Ion Etching (Deep RIE or DRIE) elevates the etching of silicon wafers with high precision, enabling manufacturing of MEMS devices.
Read how MEMS sensors are critical as the human driver increasingly relinquishes control to electronic systems, in tomorrow’s world of autonomous vehicles.
Read how MEMS, micro versions of normal full-size mechanical and electrical components, allow smartphones, wearables, and automobiles to do amazing things.