Atomica AI Thermal Microstructures Platform Brings Cooling Inside the AI Package
Atomica’s AI Thermal Microstructures Platform enables local cooling, heat spreading, fluid control & advanced package integration.
Atomica’s AI Thermal Microstructures Platform enables local cooling, heat spreading, fluid control & advanced package integration.
The platform helps customers build microfabricated structures for compact laser sources, fiber coupling, thermal stability, and AI optical interconnect.
Atomica more than doubled revenue over the last year as demand grew for AI photonics, advanced microfabrication, and AI-enabled fab execution.
Its simulation capability helps teams evaluate design performance early, reduce iteration cycles, and streamline the path to successful fabrication.
Atomica attracts capital from Cerium Technology Ventures, Novo Tellus Capital Partners, and St. Cloud Capital