What are Through Silicon Vias (TSVs)?
Learn about Atomica’s groundbreaking Through Silicon Via (TSV) technology and how it revolutionizes semiconductor integration.
Learn about Atomica’s groundbreaking Through Silicon Via (TSV) technology and how it revolutionizes semiconductor integration.
Learn about the differences between a CMOS and MEMS fab and what the leading US MEMS fab, Atomica, has to offer.
Learn how Deep Reactive Ion Etching (Deep RIE or DRIE) elevates the etching of silicon wafers with high precision, enabling manufacturing of MEMS devices.
Discover what drug delivery, the fight against COVID-19, and personalized “organs” all have in common: they benefit from the tiny world of microfludics.
Read how MEMS, micro versions of normal full-size mechanical and electrical components, allow smartphones, wearables, and automobiles to do amazing things.