Wafer Level Packaging (WLP)

More than 80% of programs at Atomica implement wafer level packaging (WLP) with some projects requiring as many 6 wafers for integration and miniaturization.

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Packaging (also called semiconductor device assembly, assembly, encapsulation or sealing) is the final manufacturing stage of semiconductor device fabrication, in which integrated circuits (IC), processors, sensors, imaging devices, optoelectronics, micro-electromechanical systems (MEMS) and other components are mounted or encapsulated in a supporting case that prevents physical or environmental damage.

The case, known as a “package”, supports the electrical contacts which connect the device to a circuit board or larger system for its subsequent operation; this routing is often achieved with a redistribution layer (RDL) within an interposer. The process of bringing the fabricated device into a mountable case is referred to as packaging.

Details

  • Atomica implements materials such as silicon, glass, quartz, metals, and others to realize these devices, often mixing and matching other technology modules, such as ATOMICA’s through silicon vias (TSVs), to simplify routing and to signals to the outside world.
  • Atomica routinely achieves over 99% hermeticity with its wafer level packages, including sub-mTorr vacuum WLP for applications that require high vacuum packaging.
  • Atomica utilizes wafer-level packaging technology in several production programs that requires 4 and 5 wafers stacked together.
  • Atomica differentiates itself by blazing the trail in complex integration of process and technologies though wafer-level packaging.

Other Capabilities

Wafer Bonding

Learn how Atomica’s bonding allows hermetic and vacuum wafer-level packaging.

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TSVs

Discover Atomica’s Through-Silicon Vias (TSVs) which allow electrical signals to pass through substrates.

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Wafer Testing

Explore how Atomica’s in-process electrical, mechanical, and thermal testing enables real-time verification of functionality.

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Why Atomica?

Atomica focuses on the success of our customers’ products, with rapid prototyping and scalable production. We are a leader in microfabrication, including photonics, sensors, biotechnology, and MEMS. We provide customers device optimization, faster speed to market, and cost-efficient fabrication. Atomica operates a 30,000-square-foot class 100 cleanroom near Santa Barbara, California, supporting a wide range of capabilities and materials with ISO 9001 certification and ITAR registration. We leverage sophisticated process control analytics, artificial intelligence inspection, advanced metrology, and proprietary fab operations systems to maximize efficiency.

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