Atomica’s Plating Capabilities
Atomica’s plating capability enables the creation of tall structural and functional features, such as molds, conductive coils, magnets, actuators, etc. Atomica offers the following capabilities:
- Electroplating Electroplating is a process where a metal is deposited onto a conductive substrate by passing an electric current through an electrolyte solution. The substrate acts as the cathode, attracting positively charged metal ions from the solution to form a thin metal layer.
- Electroless Plating Electroless plating is a chemical process that deposits a metal coating on a substrate without using an external electrical current. The deposition occurs through a redox reaction, often catalyzed by the surface itself.
- Pulse Plating Pulse plating is an advanced electroplating method where the electric current is applied in pulses rather than a continuous flow. This allows for better control over the deposition rate and quality of the coating.
For more details on our plating capabilities, please contact our technical team or download our fab technology guide.
Other Capabilities
Why Atomica?
Atomica focuses on the success of our customers’ products, with rapid prototyping and scalable production. We are a leader in microfabrication, including photonics, sensors, biotechnology, and MEMS. We provide customers device optimization, faster speed to market, and cost-efficient fabrication. Atomica operates a 30,000-square-foot class 100 cleanroom near Santa Barbara, California, supporting a wide range of capabilities and materials with ISO 9001 certification and ITAR registration. We leverage sophisticated process control analytics, artificial intelligence inspection, advanced metrology, and proprietary fab operations systems to maximize efficiency.
Next Steps
Download our comprehensive eBook on Wafer Level Packaging
Talk to our engineering team about your deposition project
Read about our investment in cutting-edge MEMS tools