Annealing and Oxidation

Atomica’s advanced Thermal Oxidation and Annealing processes enhance insulation, reduce defects, relieve stress, and optimize device performance with precision.

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Atomica’s Thermal Oxidation and Annealing processes play a crucial role in enhancing the performance and reliability of microfabrication, including MEMS, sensors, photonics, and biochips. Thermal oxidation delivers high-quality silicon dioxide layers for superior insulation and surface passivation, while annealing reduces defects, relieves internal stress, and optimizes material properties. By tailoring these techniques to specific design needs, we ensure precise control over electrical, mechanical, and thermal performance, enabling robust solutions for even the most demanding applications.

Atomica’s Annealing and Oxidation Capabilities

We offer various Annealing and Oxidation capabilities. Read more of offering below.

  • Furnace Annealing Furnace annealing is a high-temperature thermal process used to modify the physical and sometimes chemical properties of materials. In microfabrication, annealing is often done in a controlled atmosphere (e.g., nitrogen, argon) to relieve stress, improve crystallinity, and activate dopants after ion implantation.
  • Vacuum Annealing Vacuum annealing is a heat treatment process performed in a vacuum chamber to prevent oxidation or contamination during high-temperature annealing. The lack of oxygen helps to maintain the purity and surface integrity of the materials.
  • Frit annealing Frit annealing refers to the process of fusing powdered glass (frit) to a substrate using controlled heat. This method is used to create glass seals or bonds between different materials.
  • Oxidation Annealing Oxidation annealing involves exposing a material to oxygen or a reactive gas while annealing it at high temperatures. This process forms a thin oxide layer on the surface, which can serve as a protective layer or an electrical insulator.

For more details on our Annealing and Oxidation capabilities, please contact our technical team or download our fab technology guide.

 

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Other Capabilities

Photolithography

Learn about Atomica’s photolithography technologies and leading-edge greyscale (3D) lithography.

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Dry Etching

Atomica offers Deep Reactive Ion Etching (DRIE), Reactive Ion Etching and various other dry etch capabilities

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Wafer Testing

Learn how Atomica’s in-process electrical, mechanical, and thermal testing enables real-time verification of functionality.

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Why Atomica?

Atomica focuses on the success of our customers’ products, with rapid prototyping and scalable production. We are a leader in microfabrication, including photonics, sensors, biotechnology, and MEMS. We provide customers device optimization, faster speed to market, and cost-efficient fabrication. Atomica operates a 30,000-square-foot class 100 cleanroom near Santa Barbara, California, supporting a wide range of capabilities and materials with ISO 9001 certification and ITAR registration. We leverage sophisticated process control analytics, artificial intelligence inspection, advanced metrology, and proprietary fab operations systems to maximize efficiency.

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