Learn about Atomica’s groundbreaking Through Silicon Via (TSV) technology and how it revolutionizes semiconductor integration.
Learn how Atomica’s switch is transforming the electric vehicles, IoT, medical imaging, aerospace and defense industries.
Learn how Deep Reactive Ion Etching (Deep RIE or DRIE) elevates the etching of silicon wafers with high precision, enabling manufacturing of MEMS devices.
Read how MEMS, micro versions of normal full-size mechanical and electrical components, allow smartphones, wearables, and automobiles to do amazing things.