The Atomica AI Thermal Microstructures Platform is a modular microfabrication platform for the precision structures that manage heat, fluids, pressure, and thermal interfaces in high-density AI hardware — microfluidic channels, pumps, valves, diaphragms, thermal vias, silicon and glass interposers, and wafer-level packaging.

More compute means more heat — and the heat now lives inside the package. As AI accelerators, high-bandwidth memory, and co-packaged optics concentrate power into smaller volumes, thermal management is no longer a secondary packaging detail. It is becoming a gating factor for AI infrastructure deployment.

What you will learn in this guide

  • Applications of the platform — liquid-cooled AI accelerator modules, co-packaged and near-packaged optics, photonic interposer assemblies, high-bandwidth memory packages, and rugged edge AI modules
  • How the platform moves, spreads, isolates, senses, and manages heat inside high-density AI hardware
  • The eight microfabrication technology modules — from microfluidic channels, pumps, valves, and diaphragms to TSVs, TGVs, interposers, and wafer-level packaging
  • The five system architectures, from high-density AI compute cooling to microfluidic control and monitoring
  • Design considerations across thermal, fluidic, mechanical, electrical, and optical tradeoffs — and what determines whether a design can scale