Learn how critical wafer bonding is in MEMS, sensors, microfluidic biochips, photonics devices, wafer level packaging and 3D heterogeneous integration.
Learn how Deep Reactive Ion Etching (Deep RIE or DRIE) elevates the etching of silicon wafers with high precision, enabling manufacturing of MEMS devices.
Discover the benefits of Silicon Optical Benches (SiOBs) and how they improve costs, precision, and size by moving optical integration to the wafer level.
Read how this massive capability upgrade advances Atomica to the forefront of the MEMS industry enabling production of sensors, photonics, and biochips.
Learn how the plasma etch system puts Atomica at the cutting edge of MEMS /sensors manufacturing and extends its development and production capabilities.